VI-Characteristics of Diode Simulation with Multisim

VI Characteristics of PN Junction Diode Simulation with Multisim software version 12.0

AIM:
To plat the VI characteristics of Semiconductor PN Junction diode.
Required Virtual Components.

S.NONAMEDESCRIPTIONQUANTITY
1.RESISResistor 1k1
2.Diode1N40071
3.DC SourceDC 12V12V
THEORY:

The positive supply is connected to the anode and a negative supply to the cathode of the PN Semiconductor diode is called Forward Bias. Increase the +ve supply to anode, the depletion region width decrease and conduction of electron increase.
The VI characteristics may be obtained by performed DC sweep analysis. The applied voltage is vary from an initial value of 0 to stop vale of 1 V in the step of increment  0.1v.  To get VI characteristics, the currents corresponding to varying input voltages are noted and VI graph is observed in the output graph.
PROCEDURE:
Double click the multisim icon.
Select virtual components.
Click power source icon and select DC power supply.
Click diode family icon and select virtual diode.
Diode Circuit
PN Junction Diode Circuit
Complete the Connection wiring with the help mouse.
Change the voltage value = 1V.
Save your experiment with its name.
Voltage Selection
Click simulate > Analyses > DC sweep then get below icon
dc sweep
Enter Start, Stop and increment value as below mentioned.
Dioce analysis
Click Output > All variables
Select diode (Id)current to output with the help of add button.
out
Finally click simulate button to get below output graph.
graph1
Click Graph icon button.
graph white
RESULT:
The output waveform were observed in Graph waveform.
VIDEO DEMO:
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Subramanian
Subramanian

Subramanian MK, currently serving as a workshop instructor at Sakthi Polytechnic College, Erode Tamil Nadu. With a career spanning 25 + years, Subramanian MK has dedicated himself to advancing knowledge in Electronics and Communication Engineering (ECE). His passion for exploring new technologies has led to the development of numerous projects, showcasing expertise in IoT and PCB design.

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